Semiconductor wafer transfer device cut from aluminum plate material.
Dimensions and precision: t40×200×200. Introducing processing using aluminum (A5052)!
The processing type is machining from plate material, with the processing points being flatness of 0.05 and parallelism of 0.05. The corresponding lot size is 30 pieces per month for 5 years. In addition to cutting and polishing processing at our own factory, we also accept molding and surface treatment utilizing a network of partner factories, so please feel free to consult us when needed. 【Product Specifications】 ■Material: Aluminum (A5052) ■Processing Type: Machining from plate material ■Dimensions & Tolerance: t40×200×200 ■Industry: Industrial machinery ■Corresponding Lot Size: 30 pieces per month for 5 years *For more details, please refer to the PDF document or feel free to contact us.
- Company：諏訪機械製作所
- Price：Other
